CMP
Model：PAD
Polishing pad: has high polishing rate, high planarization efficiency and excellent polishing stability. Polishing pad used in the precision polishing process of the semiconductor and optoelectronic industries. It has high polishing stability and excellent wear resistance, helping customers further optimize costs, and can be applied to various machines.
CMP PAD
Application ：CMP process. Including OX、W、Cu、Poly、Buffing
Product ：SV300、GV3000、XD120、JM108T、KS88
Soft Pad
Application ：Barrier CMP、Buffing、Cleaning、Virgin/Reclaim wafer
Product ：JK91、JOHO 6000
If you are interesting in these products, visit iVT tech. or connected to iVT tech. to get more information.